
Slide Solder Defects:
Solder “Shorts” or “Bridges”:
Open
Angle
The iron tip is programmed with a
slight “OPEN” angle. This allows the
front of the tip to contact each terminal
and the rear edge of the tip to heat each
pad as the tip slides. The “OPEN”
angle minimizes the possibility for
bridges to occur as the entire tip surface
never contacts two pins simultaneously.
There are several factors that can contribute to a solder short or bridge. These factors include:
a) Flux void in wire core b) Wire feed position
c) Iron tip position d) Inconsistent lead location
e) Iron tip temperature f) Oxides, residual flux on tip (post clean)
If the robot is soldering well and then the quality becomes poor, the main reason is that something has
changed in the set-up. Most likely, the solder wire feed position has been accidentally moved or mis-
adjusted or was loose and has drifted out of position. Prior to making any programming changes, check the
set-up of the tip and feed position to ensure that they are correct.
The solder feed needs to contact the Tin electro-
plated area of the iron tip. Solder feed heights
above this area can cause major quality issues.
The solder feed height in the photo above illustrates
the proper height setting for feeding into a slide
solder tip.
Poor flux distribution on PCB. This was caused by
feeding solder too high on the tip above the Tin
electroplate, this caused the flux to burn away and
become in-effective. This problem was fixed by
lowering the feed position.
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